At Orbit & Skyline, packaging is more than just a container, it's a strategic enabler that protects, transports, and delivers your product safely, sustainably, and efficiently. Our Packaging Engineering team brings deep expertise in developing Primary, Secondary, and Tertiary Packaging tailored for the Semiconductor industry, in compliance with SEMI standards.
We engineer packaging solutions that meet technical, logistical, and environmental demands, ensuring every product reaches its destination in perfect condition.
We develop packaging using a range of advanced materials and technologies, including:
Our process begins with a thorough understanding of the product and its packaging needs. We consider:
We use 3D CAD software to conduct virtual fit checks and simulate packaging performance early in the design phase. Before finalizing, we support:
We are committed to developing solutions that reduce environmental impact and operating costs. Our sustainable packaging strategies include:
We ensure close coordination among all stakeholders to deliver packaging solutions that align with technical requirements and business goals. This includes:
Engineering: Early engagement in product design and qualification planning
Operations: Ensuring seamless quality integration across the supply chain
Compliance: Adhering to SEMI, ISO, and customer standards
Digital Transformation: Building scalable, traceable, and transparent processes