Packaging Engineering in Semiconductor

Packaging Engineering in Semiconductor
Packaging Engineering in Semiconductor

Client

Global semiconductor equipment manufacturer

Services

Packaging cost optimization strategy

Tools

  • Static Load Calculation
  • SEMI & ASTM STANDARDS

Results

43% cost reduction achieved

Customer Background

The customer specializes in designing and manufacturing of semiconductor equipment that drives technological advancements in the semiconductor industry. Their products and innovative solutions enable chipmakers worldwide to build cutting edge semiconductors that power progress in nearly all aspects of modern life.

Project Overview

In today’s competitive landscape, operational efficiency is paramount. This case study details how Orbit & Skyline partnered with a leading global semiconductor equipment manufacturer to tackle escalating packaging costs, achieving a remarkable 43% reduction in annual packaging cost. This transformation wasn’t just about cutting costs; it was about optimizing the overall profitability.

Project Overview

Challenges Faced

Our client, a key player in the semiconductor equipment manufacturing sector, faced significant financial strain due to outdated and inefficient packaging practices. Redundant crate designs, excessive material usage, and labour-intensive costs were eroding their bottom line. They needed a strategic partner to rethink their approach and unlock hidden value.

This project presented a distinct set of challenges that required meticulous planning, seamless collaboration, and adaptability from the team.

A few top challenges were

Non Standard Accessories Removed

Our Strategic Solution: A Value-Driven Approach

We deployed a multi-faceted strategy, leveraging our deep expertise in packaging engineering and data analytics.

Our engineers completely redesigned the wooden crate structure, eliminating unnecessary components, streamlining material usage, and simplifying assembly.

We moved away from a fragmented approach to create a standardized crate design, enabling component commonality across multiple robot models. This reduced complexity, lowered inventory costs, and improved supply chain agility.

Value-Driven Approach

We created new crate design concepts that set a product apart from earlier designs, mainly focusing on aesthetics, usability, and product appearance to achieve differentiation in the market

Technology & Talent: The Cornerstones of Success

We brought together a dedicated team of experts, including supplier engineers, manufacturing specialists, and packaging engineers. This team leveraged advanced tools like NX CAD/CAM software and Cutlist Optimizer to drive innovation and ensure precision execution.

To ensure seamless execution, we structured a cross functional hybrid team combining both onsite and offsite expertise. The team includes:

A Winning Solution

We delivered a robust solution focused on addressing excess packaging costs. Our approach emphasized data-driven decision-making, strategic and collaborative execution to optimize inventory management.

Crate DST

Tools Utilized

To achieve the project’s objectives, we leveraged advanced tools, including:

By implementing these solutions, we optimized inventory levels, reduced financial risks, and improved supply chain efficiency, ensuring long-term operational resilience for our client.

Results & Business Impact

This case study is a testament to Orbit and Skyline’s ability to deliver transformative results for our clients. We go beyond traditional cost-cutting measures, focusing on strategic optimization to unlock hidden value, improve efficiency, and drive sustainable growth.

Target achieved