Delivered Blackbox TLC Solution to Mitigate Supplier Obsolescence

TLC Solution to Mitigate Supplier Obsolescence
Delivered Blackbox TLC Solution to Mitigate Supplier Obsolescence

Client

Global Semiconductor Equipment Manufacturer

Services

  • Embedded Hardware Design
  •  
  • Firmware Development
  • Obsolescence Mitigation & Safety Solutions

Hardware Used

  • Custom Temp Controller
  •  
  • Firmware from Scratch
  • Safety Interlock
  • Testing Setup

Results

  • Obsolescence-proof Blackbox Controller
  •  
  • Fully Integrated & Tool-Tested Pilot Units
  • Supports Deposition and Etching Tool Applications

Customer Background

Our client, a global leader in semiconductor equipment manufacturing, was experiencing frequent supply-chain disruptions due to the obsolescence of third-party temperature limit controllers. These legacy systems were often shipped with firmware locks, preventing any form of tuning or customization. This led to operational inflexibility and service delays, particularly for critical process tools like deposition and etching systems.

Project Overview

The objective was to design and develop a blackbox temperature limit controller to replace unreliable, locked-out supplier solutions. The controller needed to monitor critical temperature thresholds and execute safety interlocks in real time. The solution had to be plug-compatible, configurable, and long-term supportable—ensuring seamless integration into existing tool environments without depending on external OEM vendors.

Challenges Faced

Hardware Obsolescence: Frequent EOL (End-of-Life) notices for off-the-shelf controllers disrupted manufacturing support.

Firmware Locks: OEM firmware restrictions prevented reconfiguration or calibration.

Application Criticality: The controller was used on deposition and etching tools—requiring high accuracy and strict interlock reliability.

Environmental Stress: Units needed to perform reliably under elevated temperatures and continuous tool operations.

Our Comprehensive Approach

Requirements Engineering
  • Collaborated with the customer to define functional specifications, including input/output mapping, sensor interface protocols, fault response logic, and control thresholds
  • Captured mechanical boundary conditions and tool-level integration constraints to ensure drop-in replacement capability.
Requirements Engineering
System Architecture & Hardware Design
  • Developed a detailed system block diagram outlining sensing, logic control, and interlock mechanisms.
  • Created schematic designs, selected robust components, and developed multi-layer PCBs with strict thermal and noise considerations.
  • Designed custom enclosure housing, ensuring mechanical protection, easy mounting, and thermal management.
System Architecture and Hardware Design
Firmware Development
  • Built firmware from the ground up to handle real-time temperature monitoring, alarm thresholds, safety logic, and logging.
  • Designed the logic to support sensor calibration, fault diagnostics, and over-temperature interlock triggering.
Firmware Development
Testing & Qualification
  • Executed a multi-level qualification plan including:
    • Bench-level functional testing
    • System integration with live tools
    • Elevated temperature and reliability testing for long-term stress validation
  • Performed board-level diagnostics, including I/O response time, analog input calibration, and interlock trigger timing.
Testing & Qualification
Deployment & Support
  • Produced pilot batch units, preloaded with final firmware versions for plug-and-play deployment.
  • Delivered engineering documentation and integrated firmware update utilities for future support.
Deployment & Support

Execution Roadmap

Phase 1
Requirement Gathering

Reverse engineered the existing temperature controller architecture and collaborated with customer teams for specification finalization.

Phase 2
Design & Development

Developed electrical schematics, firmware logic, and mechanical enclosures—all built in-house to ensure full control over performance and design.

Phase 3
Testing & Validation

Performed complete thermal and safety validation under elevated operational scenarios to mimic real tool conditions. 

Phase 4
Deployment

Supplied pilot units to the customer, ready for tool integration and further production rollout.

BeforeAfter

Results and Business Impact

Obsolescence-Proof Design

Obsolescence-Proof Design

Eliminated reliance on third-party suppliers and reduced the risk of future part unavailability.

Fully Customizable Controller

Fully Customizable Controller

Firmware developed in-house allowed full tuning and control flexibility for future applications.

High Reliability Under Load

High Reliability Under Load

Withstood elevated temperature testing and passed system integration tests.

Faster Time to Integration

Faster Time to Integration

Blackbox solution enabled direct drop-in replacement with minimal tool downtime.

Key Benefits Achieved

Standalone black-box controller

Standalone blackbox controller ready for critical Semiconductor processes
Customizable and supportable firmware architecture

Customizable and supportable firmware architecture
Long-term reliability

Long-term reliability under thermal and electrical stress
Seamless integration

Seamless integration into etching and deposition tool platforms
Reduced dependency on OEM

Reduced dependency on OEM suppliers